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※Hardware Platforms and Products
VT - TurboG8 - PB

·TI, OMAP35xx, 600/720MHz , Low Power Processor
·On Board DDR 166MHz, 128MB (256MB optional)
·On Board NAND Flash, 512MB (1GB Optional)
·Display: LCD, LVDS, AV Output (CB extended VGA)
·XGA,WXGA,SXGA,HD720,max 2048x2048
·2x140Pin B2B reliable Connector, EMI Consideration
·1xUSB 2.0 Host ULPI, 1xUSB OTG 2.0
·3xUART(5wires), 2xI2C Bus, 2xSPI, up to 3xSPI
Embedded Linux, WinCE, Supported


·Specifications
System Processor TI,DM/AM37xx(800M/1GHz) or OMAP35xx(600/720MHz)
ARM Cortex A8 Core, Floating unit
DSP Core available (DM/OMAP3x30,3x25)
Power Management and IO by TPS65930
On Board Memory Flash and DDR in MCP
RAM: DDR 166MHz, 256MB ( 512MB optional)
ROM: NAND Flash,512MB (1GB Optional)
Extended Memory 2xMMC/SD/SDHC
Display Video Out 2D/3D Accelerator available(OMAP3x30,3x15)
1xLVDS/TTL, up to 2048x2048
1xCVBS-S/RCA AV Output
1x24 bit DSS bus interface
Audio Audio I2S Codec, MIC1/MIC2 input, Line Output R/L
Bus GMPC 1xGPMC Bus
MCBSP 1xMCBSP Bus, up to 2xMCBSP Bus
I/Os USB 1xUSB2.0 Host High Speed (480Mbps)
1xUSB2.0 Client High Speed (480Mbps)
COM Port 3xUART (5Wires)
2xI2C
2xSPI/SSP Interface
IOs 6x6 array key board
16xGPIOs (up to 20GPIOs)
1xCamera Interface, 10bit
RTC Supported by TPS65930
Software OS Supported: Linux, WinCE
SDK Supported
Power Input 3.3V Input, 1.8V Output
Mechanical Dimensions 70 x 45mm
Environment Condition Temperature Operating:-20℃ ~ +70℃(ETR:-40℃ ~ +85℃ optional)
Storage: -40℃ ~ +85℃
Humidity 10-85%RH (Non-Condensation), operating and storage
Cooling Mode Fanless
·Download
VT-TurboG8-PB DataSheet